The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Jul. 26, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd, Hsinchi, TW;

Inventors:

Kuang-Wei Cheng, Hsinchu, TW;

Cheng-Lung Wu, Miaoli, TW;

Chyi-Tsong Ni, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B08B 3/02 (2013.01); B08B 3/04 (2013.01); H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); B08B 2240/00 (2013.01);
Abstract

A method of cleaning a semiconductor wafer includes: loading a semiconductor wafer into a cell having an annular trough; moving a plurality of nozzles into operational orientations for spraying a cleaning solution onto a top surface of the loaded semiconductor wafer; spraying the cleaning solution from each nozzle onto the top surface of the loaded semiconductor wafer in a direction defined by each nozzle's operational orientation such that a patterned flow of cleaning solution is formed on the top surface of the loaded semiconductor wafer; and collecting the cleaning solution in the annular trough of the cell as it flows off the top surface of the loaded semiconductor wafer.


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