The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Jan. 13, 2022
Applicant:

Changxin Memory Technologies, Inc., Anhui, CN;

Inventors:

Chuxian Liao, Hefei, CN;

Yuhan Zhu, Hefei, CN;

Zhan Ying, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/482 (2023.02); H10B 12/0335 (2023.02); H10B 12/315 (2023.02);
Abstract

A method for forming a semiconductor structure and the semiconductor structure are provided. The method for forming the semiconductor structure includes: providing a substrate, wherein a separate bit line structure is formed on the substrate; forming a first sacrificial layer on the side wall of the bit line structure; forming a first dielectric layer filling gap between the bit line structures; patterning the first dielectric layer and the first sacrificial layer to form a through hole, wherein the through hole and the remaining first dielectric layer and first sacrificial layer are alternately arranged; forming a second sacrificial layer on the side wall of the through hole, and filling the through hole to form a contact plug; forming a contact structure on the contact plug; and removing the first sacrificial layer to form a first air gap, and removing the second sacrificial layer to form a second air gap.


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