The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Jan. 20, 2023
Fujitsu Limited, Kawasaki, JP;
Shirou Ozaki, Yamato, JP;
Naoya Okamoto, Isehara, JP;
Yoshihiro Nakata, Atsugi, JP;
Yusuke Kumazaki, Atsugi, JP;
Toshihiro Ohki, Hadano, JP;
Naoki Hara, Sagamihara, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A high-frequency circuit board includes: a first insulating layer having a first dielectric constant; a first metal layer provided to stack over the first insulating layer; a second insulating layer provided to stack over the first metal layer, and having a second dielectric constant lower than the first dielectric constant; a second metal layer provided to stack over the second insulating layer, on which a compound semiconductor device is mounted; and first vias penetrating the second insulating layer and connecting the first metal layer with the second metal layer.