The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 08, 2022
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

Jeremy Fisher, Raleigh, NC (US);

Dan Namishia, Wake Forest, NC (US);

Scott Sheppard, Chapel Hill, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01); H01L 23/66 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H01L 23/66 (2013.01); H03F 1/565 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/451 (2013.01);
Abstract

Semiconductor devices are provided that include a Group III nitride-based semiconductor layer structure. A first metal layer is formed on an upper surface of the semiconductor layer structure, a first dielectric layer is formed on an upper surface of the first metal layer, and a second metal layer is formed on an upper surface of the first dielectric layer. The first metal layer, the first dielectric layer and the second metal layer form a first capacitor. A second dielectric layer is formed on an upper surface of the second metal layer, a third dielectric layer is formed on an upper surface of the second dielectric layer, and a third metal layer is formed on upper surfaces of the second and third dielectric layers. The second metal layer, the second dielectric layer and the third metal layer form a second capacitor that is stacked on the first capacitor.


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