The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Mar. 23, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Sreenivasan K. Koduri, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/495 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49586 (2013.01); H01L 24/13 (2013.01); H01L 24/17 (2013.01); H01L 23/4951 (2013.01); H01L 23/49562 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/1111 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17515 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/014 (2013.01); H01L 2924/3656 (2013.01);
Abstract

In one instance, a semiconductor package includes a metal leadframe having a first plurality of openings extending partially into the leadframe from the first side and a second plurality of openings extending partially into the leadframe from the second side together forming a plurality of leads. A pre-mold compound is positioned in the second plurality of openings that at least partially supports the plurality of leads. The semiconductor package has a plurality of bumps extending from the landing sites to a semiconductor die and a molding compounding at least partially covering the plurality of bumps and the metal leadframe. Other packages and methods are disclosed.


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