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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12191255 B1

PDFFull Text
Date of Patent:
Jan. 07, 2025

Filed:

Oct. 14, 2022

Interconnect substrate having groove around pad

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Hikaru Tanaka, Nagano, JP;

Takashi Kasuga, Nagano, JP;

Tomoyuki Shimodaira, Nagano, JP;

Hitoshi Kondo, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Nduka E Ojeh

Assistant Examiner:

Bruce R Smith

Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/482 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 23/4827 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01);
Abstract

An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

Find Patent Forward Citations

Tanaka, Hikaru. (2025). Interconnect substrate having groove around pad (U.S. Patent No. 12191255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12191255

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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