The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2025
Filed:
Aug. 09, 2022
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Naoko Yamamoto, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/7806 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/54493 (2013.01);
Abstract
An inspection method for a divided wafer includes a wafer lamination step of stacking a transfer wafer on top of a wafer that has been divided into a plurality of chips, a particle transfer step of, after the wafer lamination step is carried out, positioning the transfer wafer on a lower side and the divided wafer on an upper side and applying a vibration to the wafer stacked on the transfer wafer, to drop particles adhering to side surfaces of the chips onto the transfer wafer, and an inspection step of, after the particle transfer step is carried out, inspecting the particles on the transfer wafer.