The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Sep. 27, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventor:

Junbo Pan, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); H01L 21/0274 (2013.01);
Abstract

The present application provides a method for manufacturing a semiconductor structure, a semiconductor structure, and a memory. The method for manufacturing a semiconductor structure includes the following steps: providing a substrate, and forming a stabilizing layer on the substrate; forming a stabilizing structure consisting of a plurality of linear structures and grooves among the linear structures; forming a hard mask layer covering the stabilizing structure; forming a mask pattern connected to a top of the linear structure and an inner wall of the groove on the hard mask layer; and transferring the mask pattern to the substrate.


Find Patent Forward Citations

Pan, Junbo. (2025). Method for manufacturing semiconductor structure, semiconductor structure, and memory (U.S. Patent No. 12191154). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12191154

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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