The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Apr. 26, 2022
Applicant:

Sumitomo Electric Device Innovations, Inc., Kanagawa, JP;

Inventor:

Kohei Miyashita, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); C30B 25/10 (2006.01); C30B 25/16 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
C30B 25/16 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); C30B 25/10 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 22/20 (2013.01);
Abstract

A method of manufacturing a semiconductor device, includes attaching a first susceptor to a film forming apparatus, measuring a magnitude of a warp of the first susceptor, setting a first initial film formation condition as a film formation condition of the film forming apparatus in accordance with the measured magnitude of the warp of the first susceptor, and placing a plurality of first wafers on the first susceptor and forming a first film on the plurality of first wafers under the film formation condition. The setting of the first initial film formation condition includes reading the first initial film formation condition from a recording medium storing a database. The database includes a plurality of pieces of data in which magnitudes of warps of susceptors are associated with initial film formation conditions for forming the first film.


Find Patent Forward Citations

Miyashita, Kohei. (2025). Method of manufacturing semiconductor device (U.S. Patent No. 12188149). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12188149

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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