The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Aug. 12, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Scott E. Sills, Boise, ID (US);

Durai Vishak Nirmal Ramaswamy, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 63/00 (2023.01); H10N 70/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10B 63/30 (2023.02); H10B 63/80 (2023.02); H10N 70/011 (2023.02); H10N 70/023 (2023.02); H10N 70/061 (2023.02); H10N 70/068 (2023.02); H10N 70/24 (2023.02); H10N 70/245 (2023.02); H10N 70/826 (2023.02); H10N 70/8265 (2023.02); H10N 70/841 (2023.02); H10N 70/882 (2023.02); H10N 70/883 (2023.02);
Abstract

A method of forming an array of memory cells includes forming lines of covering material that are elevationally over and along lines of spaced sense line contacts. Longitudinal orientation of the lines of covering material is used in forming lines comprising programmable material and outer electrode material that are between and along the lines of covering material. The covering material is removed over the spaced sense line contacts and the spaced sense line contacts are exposed. Access lines are formed. Sense lines are formed that are electrically coupled to the spaced sense line contacts. The sense lines are angled relative to the lines of spaced sense line contacts and relative to the access lines. Other embodiments, including structure independent of method, are disclosed.


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