The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Feb. 09, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Ting-Jung Chen, Kaohsiung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); G02B 7/02 (2021.01); H04N 23/54 (2023.01); H04N 23/68 (2023.01);
U.S. Cl.
CPC ...
B81B 3/0072 (2013.01); B81C 1/00666 (2013.01); H04N 23/54 (2023.01); H04N 23/687 (2023.01); B81B 2203/0118 (2013.01); B81B 2203/019 (2013.01); B81B 2203/0307 (2013.01); B81C 2201/0105 (2013.01); B81C 2201/0178 (2013.01); G02B 7/021 (2013.01);
Abstract
The present disclosure relates to an integrated chip structure. The integrated chip structure includes a MEMS (microelectromechanical systems) actuator. The MEMS actuator has an anchor. A proof mass continuously wraps around the anchor in a closed loop. One or more curved cantilevers are coupled between the proof mass and a frame. The frame wraps around the proof mass. The one or more curved cantilevers include curved outer surfaces arranged directly between a sidewall of the frame and a sidewall of the proof mass, as viewed in a top-view.