The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Mar. 27, 2023
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 1/0298 (2013.01); H05K 3/3457 (2013.01); B23K 2101/42 (2018.08);
Abstract
A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.