The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2024

Filed:

Oct. 28, 2021
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Nuflare Technology, Inc., Yokohama, JP;

Inventors:

Yuki Furutani, Hiratsuka, JP;

Yoshiaki Daigo, Yokohama, JP;

Takuto Umetsu, Yokohama, JP;

Shun Haruyama, Yokohama, JP;

Keiko Shiozawa, Fujisawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 1/14 (2006.01); B05B 1/00 (2006.01);
U.S. Cl.
CPC ...
B05B 1/14 (2013.01); B05B 1/005 (2013.01);
Abstract

According to one embodiment, a rectifying plate is opposed to a plurality of nozzles which are configured to inject a fluid. The rectifying plate is configured to rectify the fluid. The rectifying plate includes: a plurality of high flow path resistance areas, and a low flow path resistance area. Each of the high flow path resistance areas includes a nozzle-facing area which is opposed to one of the plurality of nozzles. The low flow path resistance area surrounds each of the plurality of high flow path resistance areas. The low flow path resistance area includes a plurality of first through-holes to allow the fluid to pass through and having a smaller flow path resistance of the fluid than that of the high flow path resistance area.


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