The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Apr. 01, 2022
Unimicron Technology Corp., Taoyuan, TW;
Jun-Rui Huang, Tainan, TW;
Chih-Chiang Lu, New Taipei, TW;
Yi-Pin Lin, Taoyuan, TW;
Ching-Sheng Chen, Hsinchu County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.