The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
May. 31, 2021
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Yoshiaki Sakaniwa, Saitama, JP;
Toyo Ohashi, Saitama, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 1/0313 (2013.01); H05K 3/0061 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10227 (2013.01);
Abstract
There is provided an insulating resin circuit substrate including an insulating resin layer and a circuit layer consisting of a plurality of metal pieces disposed to be spaced apart in a circuit pattern shape on one surface of the insulating resin layer, in which in a case where a surface of the insulating resin layer in a gap between the metal pieces is analyzed by SEM-EDX, the area rate of a metal element constituting the metal pieces is less than 2.5%.