The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 20, 2019
Applicant:
Hitachi High-tech Corporation, Tokyo, JP;
Inventors:
Atsushi Sawada, Tokyo, JP;
Tsunenori Nomaguchi, Tokyo, JP;
Assignee:
Hitachi High-Tech Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/20 (2006.01); H01J 37/26 (2006.01); H01J 37/30 (2006.01); H01J 37/305 (2006.01);
U.S. Cl.
CPC ...
H01J 37/20 (2013.01); H01J 37/26 (2013.01); H01J 37/3053 (2013.01); H01J 2237/0203 (2013.01); H01J 2237/208 (2013.01); H01J 2237/31745 (2013.01);
Abstract
A lamellaincluding an analysis portionand a cutout portionseparated from the analysis portionis produced. When a plurality of the lamellaeare transported to a lamella grid, the plurality of lamellaeare supported by a support portionprotruding from a surface of a substrate, and are mounted adjacent to each other in a Z direction. At this time, the cutout portionprevents the analysis portionfrom damage.