The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jul. 29, 2021
Applicant:
Carl Zeiss Smt Gmbh, Oberkochen, DE;
Inventors:
Jens Timo Neumann, Aalen, DE;
Abhilash Srikantha, Neu-Ulm, DE;
Christian Wojek, Aalen, DE;
Thomas Korb, Schwaebisch Gmuend, DE;
Assignee:
Carl Zeiss SMT GmbH, Oberkochen, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06F 16/55 (2019.01); G06F 18/20 (2023.01); G06F 18/214 (2023.01); G06N 20/00 (2019.01); G06T 7/33 (2017.01); G06V 30/24 (2022.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G06F 16/55 (2019.01); G06F 18/2155 (2023.01); G06F 18/285 (2023.01); G06N 20/00 (2019.01); G06T 7/0006 (2013.01); G06T 7/001 (2013.01); G06T 7/344 (2017.01); G06V 30/2504 (2022.01); G06T 2200/04 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20016 (2013.01); G06T 2207/20021 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01); G06V 30/2528 (2022.01); G06V 2201/06 (2022.01);
Abstract
A method includes obtaining an image data set that depicts semiconductor components, and applying a hierarchical bricking to the image data set. In this case, the bricking includes a plurality of bricks on a plurality of hierarchical levels. The bricks on different hierarchical levels have different image element sizes of corresponding image elements.