The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Jul. 06, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Wei-Chung Hu, New Taipei, TW;

Chi-Ta Lu, Yilan County, TW;

Chi-Ming Tsai, Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/30 (2020.01); G03F 1/70 (2012.01); G03F 7/00 (2006.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G03F 1/70 (2013.01); G03F 7/70633 (2013.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 2119/18 (2020.01);
Abstract

A method for manufacturing a semiconductor device is provided. The method includes the following operations. A first layout including a plurality of first features is provided. A modified second layout is determined. The modified second layout includes a plurality of modified features separated from each other, and each of the plurality of modified features respectively overlaps each of the plurality of first features. The modified second layout is outputted to a photomask.


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