The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Apr. 22, 2022
Applicant:

Enf Technology Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jeong Sik Oh, Gyeonggi-do, KR;

Hak Soo Kim, Gyeonggi-do, KR;

Myung Ho Lee, Gyeonggi-do, KR;

Assignee:

ENF TECHNOLOGY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/08 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09K 13/08 (2013.01); H01L 21/30604 (2013.01);
Abstract

Provided is an etchant composition for a semiconductor substrate which may selectively etch a high-concentration doped layer of an extrinsic semiconductor, and according to the present disclosure, an etchant composition for a semiconductor substrate which, in etching an extrinsic semiconductor substrate including doped layers having different doping concentrations, may etch the high-concentration doped layer at a high selection ratio, and suppress bubble formation during an etching process to allow uniform and stable etching, an etching method using the same, and a manufacturing method of a semiconductor substrate may be provided.


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