The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2024

Filed:

Jul. 15, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

Ming Chyi Liu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/762 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1203 (2013.01); H01L 21/76251 (2013.01); H01L 21/76264 (2013.01); H01L 21/84 (2013.01);
Abstract

Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip comprises a semiconductor substrate. A semiconductor layer is disposed over the semiconductor substrate. An insulating structure is buried between the semiconductor substrate and the semiconductor layer. The insulating structure has a first region and a second region. The insulating structure has a first thickness in the first region of the insulating structure, and the insulating structure has a second thickness different than the first thickness in the second region of the insulating structure.


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