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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12168709 B1

PDFFull Text
Date of Patent:
Dec. 17, 2024

Filed:

Dec. 17, 2021

Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module

Applicant:

Resonac Corporation, Tokyo, JP;

Inventors:

Koji Morita, Tokyo, JP;

Ryo Shimokawa, Tokyo, JP;

Shinji Tsuchikawa, Tokyo, JP;

Keiichi Kasuga, Tokyo, JP;

Chihiro Hayashi, Tokyo, JP;

Tomio Iwasaki, Tokyo, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:

FITCH, EVEN, TABIN & FLANNERY LLP

Primary Examiner:

Betelhem Shewareged

Int. Cl.
CPC ...
C08F 283/04 (2006.01);
U.S. Cl.
CPC ...
C08F 283/04 (2013.01);
Abstract

A thermosetting resin composition containing a maleimide compound (a) having at least one N-substituted maleimide group, and a compound (b) represented by the following general formula (1) exhibiting no reactivity with the maleimide group of the component (a) (Xrepresents a single bond or a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; Rand Reach independently represent a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, a substituted or unsubstituted aromatic hydrocarbon group having 6 to 18 ring carbon atoms, a substituted or unsubstituted heterocyclic aromatic hydrocarbon group having 5 to 20 ring atoms, an oxygen atom-containing group, or a group containing a combination of these groups; and m and n each independently represent an integer of 0 to 5).

Find Patent Forward Citations

Morita, Koji. (2024). Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module (U.S. Patent No. 12168709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12168709

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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