The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Aug. 27, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Giorgio Servalli, Fara Gera d'Adda, IT;

Marcello Mariani, Milan, IT;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); G11C 11/22 (2006.01); H10B 53/10 (2023.01); H10B 53/30 (2023.01);
U.S. Cl.
CPC ...
H10B 12/315 (2023.02); G11C 11/221 (2013.01); H10B 12/0335 (2023.02); H10B 12/05 (2023.02); H10B 12/482 (2023.02); H10B 53/10 (2023.02); H10B 53/30 (2023.02);
Abstract

Some embodiments include an assembly having first and second pillars. Each of the pillars has an inner edge and an outer edge. A first gate is proximate a channel region of the first pillar. A second gate is proximate a channel region of the second pillar. A shield line is between the first and second pillars. First and second bottom electrodes are over the first and second pillars, respectively; and are configured as first and second angle plates. An insulative material is over the first and second bottom electrodes. The insulative material may be ferroelectric or non-ferroelectric. A top electrode is over the insulative material. Some embodiments include methods of forming assemblies.


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