The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Dec. 12, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

You-Cheng Xiao, Taichung County, TW;

Jhih-Siang Hu, New Taipei, TW;

Ru-Yu Wang, New Taipei, TW;

Jung-Hsuan Chen, Hsinchu, TW;

Ting-Wei Chiang, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 10/00 (2023.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H10B 10/18 (2023.02); H01L 23/5286 (2013.01); H10B 10/12 (2023.02);
Abstract

A method includes: abutting a first logic cell having a first cell height to a first memory cell having the first cell height; forming a first conductive rail and a second conductive rail at opposite sides of the first memory cell, respectively; forming a plurality of first conductive rails between the first conductive rail and the second conductive rail; forming a third conductive rail and a fourth conductive rail at opposite sides of the first logic cell, respectively; and forming a plurality of second conductive rails between the third conductive rail and the fourth conductive rail. An amount of the plurality of second conductive rails is larger than an amount of the plurality of first conductive rails.


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