The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Nov. 08, 2021
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Manabu Nakagawasai, Tokyo, JP;
Motoi Yamagata, Tokyo, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 21/67 (2006.01); G01K 1/14 (2021.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H01L 21/67248 (2013.01); G01K 1/14 (2013.01); H05K 2203/0147 (2013.01); H05K 2203/104 (2013.01);
Abstract
There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.