The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

Jul. 24, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Tzu-Hsuan Yeh, Taoyuan, TW;

Chern-Yow Hsu, Chu-Bei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 21/308 (2013.01); H01L 24/05 (2013.01); H01L 2224/03831 (2013.01);
Abstract

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a plurality of interconnects disposed within a dielectric structure over a substrate. A conductor is disposed over at least one of the plurality of interconnects. A protective layer is disposed on the conductor and a mask layer is disposed on the protective layer. One or more passivation layers are disposed on the mask layer. The protective layer, the mask layer, and the one or more passivation layers respectively have one or more sidewalls directly over the conductor.


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