The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Sep. 17, 2020
Intel Corporation, Santa Clara, CA (US);
Aleksandar Aleksov, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Benjamin Duong, Phoenix, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Miranda Ngan, Chandler, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.