The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Dec. 10, 2020
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventor:
Minwoo Lee, Chongqing, CN;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/36 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A component carrier and a method of manufacturing a component carrier are disclosed. The component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an interposer embedded in the stack and having a plurality of vertically extending electrically conductive through connections, and electrically conductive structures in the stack laterally on both sides of the interposer.