The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
May. 20, 2019
Applied Materials, Inc., Santa Clara, CA (US);
Helder Lee, San Jose, CA (US);
Nicholas Michael Kopec, Santa Clara, CA (US);
Leon Volfovski, Mountain View, CA (US);
Douglas R. McAllister, San Ramon, CA (US);
Andreas Schmid, Meyriez, CH;
Jeffrey Hudgens, San Francisco, CA (US);
Yogananda Sarode Vishwanath, Bangalore, IN;
Steven Babayan, Los Altos, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.