The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2024

Filed:

May. 12, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sung Hyun Park, Daegu, KR;

Seo Hyun Kim, Hwaseong-si, KR;

Seung Ho Kim, Seongnam-si, KR;

Young Chan Kim, Hwaseong-si, KR;

Young-Hoo Kim, Yongin-si, KR;

Tae-Hong Kim, Seoul, KR;

Hyun Woo Nho, Yongin-si, KR;

Seung Min Shin, Suwon-si, KR;

Kun Tack Lee, Suwon-si, KR;

Hun Jae Jang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); G03F 7/00 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); H01L 21/6704 (2013.01); G03F 7/3021 (2013.01); G03F 7/70925 (2013.01);
Abstract

A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.


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