The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Feb. 16, 2022
Nxp Usa, Inc., Austin, TX (US);
Humayun Kabir, Gilbert, AZ (US);
Vikas Shilimkar, Chandler, AZ (US);
Ibrahim Khalil, Gilbert, AZ (US);
Kevin Kim, Chandler, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A device includes a semiconductor substrate, a source metallization over an active area of the semiconductor substrate, a through-substrate via electrically connected to the source metallization, and an input bond pad formed in the semiconductor substrate and spaced apart from the active area. The input bond pad is electrically connected to a set of gate structures. The device includes a first inductive coil over the semiconductor substrate between a first portion of the source metallization and a second portion of the source metallization and a first capacitor over the semiconductor substrate between the first portion of the source metallization and the second portion of the source metallization. The first inductive coil and the first capacitor are connected in series between the input bond pad and the through-substrate via.