The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2024

Filed:

Jan. 13, 2022
Applicant:

Scientech Corporation, Taipei, TW;

Inventors:

Chuan-Chang Feng, Taipei, TW;

Mao-Lin Liu, Taipei, TW;

Assignee:

SCIENTECH CORPORATION, Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67057 (2013.01); H01L 21/67051 (2013.01); H01L 21/6708 (2013.01); H01L 21/67086 (2013.01);
Abstract

This disclosure provides a wafer processing method having the following steps: providing a wafer (), an immersion device (), a carrier (), and a spray device (); turning the wafer () from a horizontal manner to an upright manner; upright placing the wafer () into the immersion device () for immersion; taking the wafer () out from the immersion device () and placing that onto the carrier () horizontally; spraying a liquid on the wafer () by the spray device (); rinsing the wafer (); rotating the carrier () to dry the wafer (). Multiple steps for processing the wafer () may be performed on the same carrier () to accelerate the process.


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