The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Jun. 21, 2021
Applicant:
Echem Solutions Corp., Taoyuan, TW;
Inventors:
Assignee:
eChem Solutions Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 179/08 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 73/1007 (2013.01); C08G 73/121 (2013.01); C09J 7/38 (2018.01); C09J 7/405 (2018.01); C09J 179/08 (2013.01);
Abstract
A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6.