The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Mar. 25, 2020
Applicants:
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Inventors:
Masamoto Tanaka, Tokyo, JP;
Kiyotsugu Komori, Saitama, JP;
Keisuke Akashi, Saitama, JP;
Katsuhiko Hoshino, Saitama, JP;
Tsunekazu Yamazaki, Saitama, JP;
Takayuki Kobayashi, Tokyo, JP;
Sukeyoshi Yamamoto, Tokyo, JP;
Kensuke Misawa, Tokyo, JP;
Assignees:
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
NIPPON MICROMETAL CORPORATION, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/30 (2006.01); B23K 35/02 (2006.01); B23K 101/40 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
B23K 35/3013 (2013.01); B23K 35/0244 (2013.01); B23K 2101/40 (2018.08); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au—Sn-based alloy, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.