The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Jun. 11, 2021
Applicant:

Sien (Qingdao) Integrated Circuits Co., Ltd., Shandong, CN;

Inventors:

Min-Hwa Chi, Qingdao, CN;

Conghui Liu, Qingdao, CN;

Huan Wang, Qingdao, CN;

Longkang Yang, Qingdao, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 21/266 (2006.01); H01L 21/761 (2006.01); H01L 21/762 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/26513 (2013.01); H01L 21/266 (2013.01); H01L 21/761 (2013.01); H01L 29/0684 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/66712 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 21/76294 (2013.01); H01L 29/0623 (2013.01);
Abstract

The present invention provides a power device with super junction structure (or referred to as super junction power device) and a method of making the same. When making a super junction power device, impurity of a second conductive type may be implanted into an epitaxial layer of a first conductive type to form a floating island of the second conductive type and a pillar of the second conductive type successively through a super junction mask (or reticle) after forming the epitaxial layer of the first conductive type, directly through a well mask (or reticle) before or after forming a well region of the second conductive type, and directly through a contact mask (or reticle) before or after forming a contact structure. Multiple epitaxial processes and deep trench etching process may not be needed. Therefore, the process is simple, the cost is low and yield and reliability are high. Because the super junction power device of the present invention has both the floating island of the second conductive type and the pillar of the second conductive type, in open state, a breakdown voltage may be raised and both Miller capacitance and input capacitance can be decreased and in on state, an on-state resistance can be decreased.


Find Patent Forward Citations

Chi, Min-Hwa. (2024). Super junction power device and method of making the same (U.S. Patent No. 12154943). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12154943

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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