The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Feb. 25, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kazuhito Tsuji, Tokyo, JP;

Masashi Obuchi, Tokyo, JP;

Masashi Shimoyama, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/10 (2006.01); C25D 17/06 (2006.01); C25D 21/04 (2006.01);
U.S. Cl.
CPC ...
C25D 21/10 (2013.01); C25D 17/06 (2013.01); C25D 21/04 (2013.01);
Abstract

Provided is a technique that ensures the suppressed deterioration of plating quality of a substrate due to air bubbles that remain on a surface to be plated of the substrate. A plating apparatusincludes a plating tank, a substrate holder, a rotation mechanism, and an elevating mechanism. The plating tankis configured to accumulate a plating solution and include an anodearranged inside the plating tank. The substrate holderis arranged above the anode and configured to hold a substrate as a cathode such that a surface to be plated of the substrate faces downward. The substrate holder includes a ringprojecting below an outer peripheral edge of the surface to be plated of the substrate. The rotation mechanismis configured to rotate the substrate holder. The elevating mechanismis configured to elevate the substrate holder. The ring has a lower surface, and at least one protrusionprojecting toward a lower side is arranged on a part of the lower surface.


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