The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Nov. 11, 2022
Applicant:

Shenzhen Envicool Technology Co., Ltd., Shenzhen, CN;

Inventors:

Viacheslav Stetsyuk, Shenzhen, CN;

Ye Wang, Shenzhen, CN;

John C. Chai, Shenzhen, CN;

Lichuan Wei, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20418 (2013.01);
Abstract

A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.


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