The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Apr. 11, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Jean-Pierre Colinge, Blot l'Eglise, FR;

Carlos H Diaz, Los Altos Hills, CA (US);

Yee-Chia Yeo, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/426 (2006.01); H01L 21/441 (2006.01); H01L 21/461 (2006.01); H01L 21/477 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 21/8256 (2006.01); H01L 21/8258 (2006.01); H01L 27/06 (2006.01); H01L 27/088 (2006.01); H01L 27/12 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/24 (2006.01); H01L 29/267 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66969 (2013.01); H01L 21/02521 (2013.01); H01L 21/02573 (2013.01); H01L 21/02576 (2013.01); H01L 21/02579 (2013.01); H01L 21/02598 (2013.01); H01L 21/0262 (2013.01); H01L 21/02636 (2013.01); H01L 21/02667 (2013.01); H01L 21/426 (2013.01); H01L 21/441 (2013.01); H01L 21/461 (2013.01); H01L 21/477 (2013.01); H01L 21/76224 (2013.01); H01L 21/76895 (2013.01); H01L 21/823412 (2013.01); H01L 21/823487 (2013.01); H01L 21/8256 (2013.01); H01L 21/8258 (2013.01); H01L 27/0688 (2013.01); H01L 27/088 (2013.01); H01L 27/1207 (2013.01); H01L 27/1222 (2013.01); H01L 27/127 (2013.01); H01L 29/04 (2013.01); H01L 29/0649 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/24 (2013.01); H01L 29/267 (2013.01); H01L 29/42392 (2013.01); H01L 29/66742 (2013.01); H01L 29/7827 (2013.01); H01L 29/78618 (2013.01); H01L 29/78642 (2013.01); H01L 29/78681 (2013.01); H01L 29/78696 (2013.01); H01L 21/823885 (2013.01); H01L 27/092 (2013.01);
Abstract

Devices, and methods of forming such devices, having a material that is semimetal when in bulk but is a semiconductor in the devices are described. An example structure includes a substrate, a first source/drain contact region, a channel structure, a gate dielectric, a gate electrode, and a second source/drain contact region. The substrate has an upper surface. The channel structure is connected to and over the first source/drain contact region, and the channel structure is over the upper surface of the substrate. The channel structure has a sidewall that extends above the first source/drain contact region. The channel structure comprises a bismuth-containing semiconductor material. The gate dielectric is along the sidewall of the channel structure. The gate electrode is along the gate dielectric. The second source/drain contact region is connected to and over the channel structure.


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