The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2024

Filed:

Mar. 06, 2023
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Venkata Naga Lakshman Pasala, Milpitas, CA (US);

Wei Wang, Dublin, CA (US);

Jiangli Zhu, San Jose, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/42 (2006.01); G11C 7/02 (2006.01); G11C 29/40 (2006.01); G11C 29/44 (2006.01); G11C 29/12 (2006.01);
U.S. Cl.
CPC ...
G11C 29/42 (2013.01); G11C 7/02 (2013.01); G11C 29/40 (2013.01); G11C 29/4401 (2013.01); G11C 2029/1208 (2013.01); G11C 2029/4002 (2013.01);
Abstract

A system includes a plurality of memory dice and a processing device coupled to the plurality of memory dice. The processing device is to determine whether an error correcting code (ECC) check of ECC-protected data read from a die of the plurality of memory dice results in detecting an error. In response to detecting the error from the ECC-protected data, the processing device performs a confirmation check that the error is a result of a defect in the die. In response to the confirmation check confirming the die is defective, the processing device ignores a temperature value from the die when determining whether to trigger a thermal-related operation.


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