The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
Jan. 23, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Sunil Kothari, Palo Alto, CA (US);
Tod Heiles, Sumner, WA (US);
Juan Carlos Catana Salazar, Guadalajara, MX;
Jun Zeng, Palo Alto, CA (US);
Gary J. Dispoto, Palo Alto, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/165 (2017.01); B29C 64/188 (2017.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01); G06N 3/08 (2023.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/165 (2017.08); B29C 64/188 (2017.08); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); G06N 3/08 (2013.01); B33Y 30/00 (2014.12);
Abstract
Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.