The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Mar. 05, 2021
Applicant:

Xidian University, Xi'an, CN;

Inventors:

Jincheng Zhang, Xi'an, CN;

Lu Hao, Xi'an, CN;

Zhihong Liu, Xi'an, CN;

Junwei Liu, Xi'an, CN;

Kunlu Song, Xi'an, CN;

Yachao Zhang, Xi'an, CN;

Weihang Zhang, Xi'an, CN;

Yue Hao, Xi'an, CN;

Assignee:

Xidian University, Xi'an, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 29/06 (2006.01); H01L 29/778 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 23/3738 (2013.01); H01L 29/0684 (2013.01); H01L 23/367 (2013.01); H01L 29/778 (2013.01); H01L 29/872 (2013.01);
Abstract

A material structure for silicon-based gallium nitride microwave and millimeter-wave devices and a manufacturing method thereof are provided. The material structure includes: a silicon substrate; a dielectric layer of high thermal conductivity, disposed on an upper surface of the silicon substrate, and an uneven first patterned interface being formed between the dielectric layer and the silicon substrate; a buffer layer, disposed on an upper surface of the dielectric layer, and an uneven second patterned interface being formed between the buffer layer and the dielectric layer; a channel layer, disposed on an upper surface of the buffer layer; and a composite barrier layer, disposed on an upper surface of the channel layer. In the material structure, the uneven patterned interfaces increase contact areas of the interfaces, a thermal boundary resistance and a thermal resistance of device are reduced, and a heat dissipation performance of device is improved.


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