The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
May. 10, 2022
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Ming-Chih Hsu, Taichung, TW;
Chiung-Lin Hsu, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); H01L 23/562 (2013.01); H10B 12/0335 (2023.02); H10B 12/315 (2023.02); H10B 12/482 (2023.02); H10B 12/485 (2023.02);
Abstract
A semiconductor structure includes a substrate, a first support layer, and multiple support pillars. The substrate includes a monitoring region. The monitoring region includes a first region and a second region. The first support layer is located in the first region and the second region, and is located above the substrate. The support pillars are located in the second region. The support pillars penetrate the first support layer and are not connected to each other. Each of the support pillars extends toward the substrate.