The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jun. 24, 2022
Ampere Computing Llc, Santa Clara, CA (US);
Kha Hong Nguyen, San Jose, CA (US);
Harb Ali Abdulhamid, Raleigh, NC (US);
Ampere Computing LLC, Santa Clara, CA (US);
Abstract
Generalized boot operations for disaggregated, multiple (multi-) semiconductor die ('die') computing system, and related methods and computer-readable media are disclosed. In exemplary aspects, to provide for generalized boot-up firmware/software for the computing system that does not have to be reconfigured for different configurations of dies in variations of IC packages, a CPU die (or other die) designated as a primary die is configured to perform a discoverable boot process over a side-band discovery bus to discover the other dies present in an IC package of the computing system and to then control their boot-up operations. In this manner, the boot-up firmware/software executed by the primary die to boot-up the computing system can be generalized irrespective of the number of dies and their particular configuration. In this manner, a generalized boot-up firmware/software can be provided to control boot-up operations of the computing system independent of specific dies included.