The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Dec. 13, 2021
Applicant:
Stratasys Ltd., Rehovot, IL;
Inventors:
Assignee:
Stratasys Ltd., Rehovot, IL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); B29C 64/135 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B29C 64/135 (2017.08); B29C 64/393 (2017.08); B29K 2995/0015 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); Y10T 428/23 (2015.01);
Abstract
A method of layerwise solid freeform fabrication is disclosed. The method comprises, for each of at least a few of the layers, dispensing and hardening at least a first modeling material and a second modeling material to form a core region and one or more envelope regions at least partially surrounding the core region. In some embodiments, the ratio between the elastic moduli of adjacent regions, when hardened, is from about 1 to about 20.