The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Dec. 27, 2018
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
Resonac Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C09J 7/28 (2018.01); C09J 11/04 (2006.01); H01B 1/22 (2006.01); H01B 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C09J 7/28 (2018.01); C09J 11/04 (2013.01); H01B 1/22 (2013.01); H01B 5/00 (2013.01); B32B 2264/12 (2013.01); B32B 2264/303 (2020.08); B32B 2307/202 (2013.01); B32B 2405/00 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08); C09J 2433/00 (2013.01); C09J 2471/00 (2013.01); C09J 2475/00 (2013.01);
Abstract
One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.