The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Nov. 13, 2023
Applicant:
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Inventors:
Michael J. Seddon, Gilbert, AZ (US);
Francis J. Carney, Mesa, AZ (US);
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 23/145 (2013.01); H01L 23/32 (2013.01); H01L 25/0655 (2013.01);
Abstract
Implementations of a semiconductor substrate may include a wafer including a first side and a second side; and a support structure coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side. The support structure may include an organic compound.