The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Jan. 21, 2022
Changxin Memory Technologies, Inc., Hefei, CN;
Luguang Wang, Hefei, CN;
Xiaoling Wang, Hefei, CN;
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Abstract
The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a base, the base including a substrate and a first heat dissipation structure located in the substrate, heat conductivity of the first heat dissipation structure being higher than that of the substrate, the substrate including an upper surface and a lower surface opposite to each other, and a surface of the first heat dissipation structure being exposed on the upper surface of the substrate; a second heat dissipation structure, the second heat dissipation structure being at least located on an upper surface of the first heat dissipation structure; and a through silicon via (TSV) structure, the TSV structure penetrating through an entire thickness of the second heat dissipation structure and extending into the base, the second heat dissipation structure surrounding the TSV structure, and the first heat dissipation structure surrounding the TSV structure.