The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Sep. 07, 2021
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Kioxia Corporation, Tokyo, JP;
Inventors:
Fuyuma Ito, Yokkaichi, JP;
Yasuhito Yoshimizu, Yokkaichi, JP;
Nobuhito Kuge, Yokkaichi, JP;
Yui Kagi, Yokkaichi, JP;
Susumu Obata, Yokohama, JP;
Keiichiro Matsuo, Yokohama, JP;
Mitsuo Sano, Kamakura, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Kioxia Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); C30B 25/18 (2006.01); H01L 21/02 (2006.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); C30B 25/186 (2013.01); H01L 21/02002 (2013.01); H01L 21/02005 (2013.01); H01L 22/34 (2013.01); H10B 43/27 (2023.02);
Abstract
A semiconductor wafer includes a surface having at least one recess including an inner wall surface. The inner wall surface is exposed.