The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Oct. 30, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Yuta Suzuki, Tokyo, JP;

Taro Takahashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B24B 29/04 (2006.01); B24B 37/013 (2012.01); B24B 37/10 (2012.01); B24B 49/10 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67219 (2013.01); B24B 29/04 (2013.01); B24B 37/013 (2013.01); B24B 37/105 (2013.01); B24B 49/10 (2013.01); H01L 21/30625 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67184 (2013.01); H01L 21/67748 (2013.01); H01L 22/26 (2013.01);
Abstract

A current detection section detects a current value of a swing shaft motorand generates a first output. A first processing section obtains a contact pressure corresponding to the first output from the first output using first data indicating a correspondence relationship between a contact pressure applied to a semiconductor wafer by a top ring and the first output. A second processing section obtains a second output corresponding to a contact pressure obtained by the first processing section using second data indicating a correspondence relationship between the contact pressure obtained by the first processing section and the second output.


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