The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Mar. 22, 2016
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Thomas Wagenleitner, Aurolzmunster, AT;
Thomas Plach, Stadl-Paura, AT;
Jurgen Markus Suss, Rainbach, AT;
Assignee:
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6838 (2013.01); H01L 23/32 (2013.01);
Abstract
A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.