The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2024
Filed:
Jul. 01, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Vamsi Pavan Rayaprolu, Santa Clara, CA (US);
Steven Michael Kientz, Westminster, CO (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/04 (2006.01); G11C 16/26 (2006.01); G11C 16/34 (2006.01); H03K 19/17728 (2020.01);
U.S. Cl.
CPC ...
G11C 7/04 (2013.01); G11C 16/26 (2013.01); G11C 16/3495 (2013.01); H03K 19/17728 (2013.01);
Abstract
A first analysis of each respective die of a multi-die memory device is performed. An equation to determine a respective temperature compensation (tempco) value for each respective die based on a number of program erase cycles (PECs) of the respective die based on the first analysis s determined. The equation for use in processing memory access requests directed to the respective die is stored. Whether to update the equation directed to the respective die based on a second analysis of the respective die is determined.